Project: Semiconductor Manufacturer in New England


A semiconductor facility included a two-story building that was no longer needed, so the company planned to have it demolished. Based on the age and type of building, however, it was possible that PCB-contaminated building materials were present, particularly window caulk. St.Germain was tasked with characterizing the building materials and surrounding soil to determine if PCB contamination was present, and also to develop a remediation plan. These planned actions were presented to the State environmental regulatory agency under their voluntary cleanup program.


St.Germain collected representative samples of caulk and indoor paint and found high levels of PCBs in the caulk. St.Germain established a grid around the building exterior, and composite soil samples showed that certain areas around the building also had elevated levels of PCBs from the degradation of the caulk.


A remedial work plan was submitted to and approved by the state regulatory agency. The first step was to selectively remove caulking with PCB levels above the applicable standard. This material was disposed of as hazardous waste. Shallow soil was then removed from the contaminated areas around the building. After confirmation sampling indicated PCBs in the soil and building were below action levels or not present, St.Germain supervised the building demolition with the debris going to a standard landfill. This information was provided to the State regulatory agency and they subsequently issued a closure letter.


Investigation & Characterizations

Site Remediation

Hazardous Waste Coordination

Voluntary Response Action Program (VRAP)



Polychlorinated Biphenyl (PCB)